2

Feedthru 0805/1206 Capacitors

W2F/W3F Series

T

P

L

C

P

S

W

BW

T

S

X

L

C

L

EW

W

BL

Feedthru Pad

Feedthru Pad

Common Ground

Common Ground

DIMENSIONS

LW

T

BWBL

EW

X

S

0805 MM

2.01 ± 0.20

1.25 ± 0.20

1.14 Max.

0.46 ± 0.10

0.18 + 0.25 -0.08

0.25 ± 0.13

1.02 ± 0.10

0.23 ± 0.15

(in.)

(0.079 ± 0.008)

(0.049 ± 0.008)

(0.045 Max.)

(0.018 ±0.004)

(0.007 + 0.010 -0.003)

(0.010 ± 0.005)

(0.040 ± 0.004)

(0.009 ± 0.006)

1206 MM

3.20 ± 0.20

1.60 ± 0.20

1.27 Max.

0.89 ± 0.10

0.18 + 0.25 -0.08

0.38 ± 0.18

1.60 ± 0.10

0.46 ± 0.15

(in.)

(0.126 ± 0.008)

(0.063 ± 0.008)

(0.050 Max.)

(0.035 ± 0.004)

(0.007 + 0.010 -0.003)

(0.015 ± 0.007)

(0.063 ± 0.004)

(0.018 ± 0.006)

TP

S

W

L

C

0805 MM

3.45

0.51

0.76

1.27

1.02

0.46

(in.)

(0.136)

(0.020)

(0.030)

(0.050)

(0.040)

(0.018)

1206 MM

4.54

0.94

1.02

1.65

1.09

0.71

(in.)

(0.179)

(0.037)

(0.040)

(0.065)

(0.043)

(0.028)

TYPICAL FEEDTHRU CHIP CAP CONNECTION

Feedthru Chip Component Model

Physical Layout - A

Physical Layout - B

Vcc or

Signal In

Signal In

The terminals are connected internally side to side.

Left side and right side are connected and front and

back are connected internally.

For Decoupling, the chip is usually surrounded by

four vias, two for Vcc and two for GND.

For Signal Filtering, the in and out lines need to be

separated on the circuit board.

Vcc or

Signal Out

Signal Out

Ground

Ground

Ground

Vcc

Vcc

Ground

Ground