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SC633 датащи(PDF) 12 Page - Semtech Corporation |
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SC633 датащи(HTML) 12 Page - Semtech Corporation |
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12 / 15 page ![]() SC633 2 Applications Information (continued) PCB Layout Considerations Poor layout can degrade the performance of the regula- tor and can be a contributory factor in EMI problems, ground bounce, thermal issues, and resistive voltage losses. Poor regulation and instability can result. The following design rules are recommended: Place the bucket capacitors as close to the device as possible and on the same side of the board. Use short wide copper areas between the capacitor pins and the device pins. . Place the input and output decoupling capacitors as close as possible to the device and connect these capacitors’ground pads together to the ground plane using multiple vias through a short wide copper area. Connect pin directly to the copper area under the thermal pad. The thermal pad at the center of the device is not electrically connected. Connect this pad to the ground plane using multiple vias. Use a ground plane to further reduce noise interference on sensitive circuit nodes. 2. 3. 4. 5. COUT EN IN CIN SC633 OUT C2+ C2- C1+ C1- GND C2 GND EN C1 |
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