P12/13

Version 0.6 Preliminary, Sept 2011

ML2002 Preliminary

1. To ensure the good flip-chip assembly quality, we suggest flip-chip bonding house add a “CHECK”

pin for each COG module as shown on the section of “Application Example”. Pin “LOAD” and Pin

“CHECK” shall be connected together if the flip-chip assembly is in good condition. The measured

resistance between Pin “LOAD” and Pin “CHECK” shall not more than 5 kohm.

3. Each Common (ie. COM1A and COM1B) shall not cover more than 2,000 mm

Viewing area of LCD has to be more than 2,000 mm

time where data is transferring into the IC, internal oscillator has to be disabled through IOEN pin to

prevent abnormal behavior. When data transfer finishes, internal oscillator has to be enabled again.

Suggested programming steps:

1

Disable internal oscillator through IOEN pin

2

Delay (Necessary for fast MCU)

3

Transfer data through DIN, DCLK, LOAD

4

Delay (Necessary for fast MCU)

5

Enable internal oscillator through IOEN pin

Application Note