SSM2017

–3–

REV. C

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the SSM2017 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

Typical Performance Characteristics

Figure 1. Typical THD+Noise* at G = 1, 10, 100, 1000;

*80 kHz low-pass filter used for Figures 1-2.

ABSOLUTE MAXIMUM RATINGS

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±22 V

Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . Supply Voltage

Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . 10 sec

Storage Temperature Range (P, Z Packages)

–65

°C to +150°C

°C to +150°C

Lead Temperature Range (Soldering, 60 sec) . . . . . . . . 300

°C

Operating Temperature Range . . . . . . . . . . . . –40

°C to +85°C

Thermal Resistance*

8-Pin Hermetic DIP (Z):

θ

θ

. . . . . .

°C/W

8-Pin Plastic DIP (P):

θ

°C/W

16-Pin SOIC (S):

θ

θ

. . . . . . . . . . . . .

°C/W

*

θ

θ

in socket for cerdip and plastic DIP;

θ

circuit board for SOL package.

ORDERING GUIDE

Temperature

Package

Package

Model

Range*

Description

Option

SSM2017P

–40

°C to +85°C

8-Pin Plastic DIP

N-8

SSM2017S

–40

°C to +85°C

16-Lead SOL

R-16

SSM2017S-REEL

–40

°C to +85°C

16-Lead SOL

R-16

*XIND = –40

°C to +85°C.

Figure 2. Typical THD+ Noise * at G = 2, 10, 100, 1000;