–4–

SMP04

REV. D

WAFER TEST LIMITS

SMP04G

Parameter

Symbol

Conditions

Limits

Units

Buffer Offset Voltage

±10

mV max

Hold Step

±4

mV max

Droop Rate

∆V/∆tV

25

mV/s max

Output Source Current

1.2

mA min

Output Sink Current

0.5

mA min

Output Voltage Range

OVR

0.06/10.0

V min/max

Ω

0.06/9.5

V min/max

LOGIC CHARACTERISTICS

Logic Input High Voltage

2.4

V min

Logic Input Low Voltage

0.8

V max

Logic Input Current

1

µA max

SUPPLY CHARACTERISTICS

Power Supply Rejection Ratio

PSRR

10.8 V

≤ V

DD

≤ 13.2 V

60

dB min

Supply Current

7

mA max

Power Dissipation

84

mW max

NOTE

Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed

for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.

DGND

Dice Characteristics

Die Size: 0.80 x 0.120 mil = 9,600 sq. mil

(2.032 x 3.048mm = 6.193 sq. mm)