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LMP8481MM-S/NOPB датащи(PDF) 18 Page - Texas Instruments |
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LMP8481MM-S/NOPB датащи(HTML) 18 Page - Texas Instruments |
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18 / 24 page ![]() LMP8480, LMP8481 SNVS829A – JUNE 2012 – REVISED AUGUST 2012 www.ti.com POWER SUPPLY DECOUPLING In order to decouple the LMP8480/81 from AC noise on the power supply, it is recommended to use a 0.1 μF bypass capacitor between the VCC and GND pins. This capacitor should be placed as close as possible to the supply pins. In some cases an additional 10 μF bypass capacitor may further reduce the supply noise. Do not forget that these bypass capacitors must be rated for the full supply and/or load source voltage! It is recommended that the working voltage of the capacitor (WVDC) should be at least two times the maximum expected circuit voltage. LLP DIE ATTACH PAD The bottom thermal pad of the LLP package should be tied to the same ground as the ground pin. Be aware that noise on this pad can couple into the bottom of the die, so the ground should be as clean as possible. 18 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: LMP8480 LMP8481 |
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