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VLF10045 датащи(PDF) 13 Page - Richtek Technology Corporation |
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VLF10045 датащи(HTML) 13 Page - Richtek Technology Corporation |
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13 / 15 page ![]() RT7237C 13 DS7237C-04 November 2012 www.richtek.com © Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. (a) Copper Area = (2.3 x 2.3) mm2, θJA = 75°C/W (b) Copper Area = 10mm2, θJA = 64°C/W (c) Copper Area = 30mm 2 , θJA = 54°C/W (d) Copper Area = 50mm2 , θJA = 51°C/W (e) Copper Area = 70mm 2 , θJA = 49°C/W Figure 6. Thermal Resistance vs. Copper Area Layout Design Layout Consideration Follow the PCB layout guidelines for optimal performance of the RT7237C. Keep the traces of the main current paths as short and wide as possible. Put the input capacitor as close as possible to the device pins (VIN and GND). SW node is with high frequency voltage swing and should be kept at small area. Keep analog components away from the SW node to prevent stray capacitive noise pick-up. Connect feedback network behind the output capacitors. Keep the loop area small. Place the feedback components near the RT7237C. An example of PCB layout guide is shown in Figure 8 for reference. |
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