| поискавой системы для электроныых деталей |
|
ADT14GS датащи(PDF) 7 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
ADT14GS датащи(HTML) 7 Page - Analog Devices |
|
7 / 16 page ![]() ADT14 –7– REV. 0 across an internal 1 k Ω resistor at the comparator input. The comparator output remains on until the voltage at the compara- tor input, now equal to VPTAT plus the hysteresis offset, has returned to the setpoint voltage. At this point the comparator turns off, the open-collector output is deactivated, and the hys- teresis current buffer is disabled. While Table I shows simple pin-programmable hysteresis val- ues, the user may design for intermediate values of hysteresis between 0.65 °C and 5°C using a resistive divider. To set the hysteresis in the range 0.65 °C < T HYS < 1.5 °C, a resistor is connected from the HYS pin (Pin 11) to VREF (Pin 14). The value of the resistor is given by the following equation: R1 = 57.5 1.5 − Hysteresis –57.5 For various values of THYS, the table below shows the values for R1: Table II THYS ( C) R1 (k ) 0.7 14.4 0.8 24.6 0.9 38.3 1.0 57.5 1.1 86.3 1.2 134.2 1.3 230 1.4 517.5 To set hysteresis in the range of 1.5 °C < T HYS < 5 °C, a resistor is connected from the HYS pin (Pin 11) to the ADT14’s com- mon (Pin 5). The value of the resistor is given by: R2 = 201.1 Hysteresis –1.5 –57.5 For various values of THYS, the table below shows values for R2: Table III THYS ( C) R2 (k ) 1.6 1953 1.75 746.9 2.0 344.7 2.25 210.6 2.5 143.6 2.75 103.4 3.0 76.6 3.25 57.4 3.50 43.1 3.75 31.8 4.0 22.9 4.25 15.6 4.5 9.5 4.75 4.4 The schematics for the two circuits are shown below. As the resistor values are approximate, it is a good idea to add a poten- tiometer for fine adjustments. VREF HYS ADT14 0.65 °C < T HYS < 1.5°C HYS ADT14 1.5 °C < T HYS < 5°C R2 P2 R1 P1 Figure 17. Hysteresis Connections for Miscellaneous Values Understanding Error Sources The accuracy of the VPTAT sensor output is well characterized and specified, however preserving this accuracy in a heating or cooling control system requires some attention to minimizing potential error sources. The internal sources of setpoint pro- gramming error include the initial tolerances and temperature drifts of the reference voltage VREF, the setpoint comparator input offset voltage and bias current, and the hysteresis current scale factor. When evaluating setpoint programming errors, remember that any VREF error contribution at the comparator inputs is reduced by the resistor divider ratios. Each comparator’s input bias current drops to less than 1 nA (typ) when the com- parator is tripped. This change accounts for some setpoint volt- age error, equal to the change in bias current multiplied by the effective setpoint divider ladder resistance to ground. The thermal mass of the ADT14 package and the degree of thermal coupling to the surrounding circuitry are the largest factors in determining the rate of thermal settling, which ulti- mately determines the rate at which the desired temperature measurement accuracy may be reached (see Figure 2). Thus, one must allow sufficient time for the device to reach the final temperature. The typical thermal time constant for the plastic SOIC package is approximately 70 seconds in still air. There- fore, to reach the final temperature accuracy within 1%, a set- tling time of five time constants, or six minutes, is necessary. External error sources to consider are the accuracy of the exter- nal programming resistors, ground voltage errors, and thermal gradients. The accuracy of the external programming resistors directly impacts the resulting setpoint accuracy. Thus, in fixed- temperature applications the user should select resistor toler- ances appropriate to the desired programming accuracy. Resistor temperature drift must also be taken into account. This effect can be minimized by selecting high quality components, and by keeping all components in close thermal proximity. Applications requiring high measurement accuracy require great attention to detail regarding thermal gradients. Careful circuit board layout, component placement, and protection from stray air currents are necessary to minimize common thermal error sources. The user should also take care to keep the bottom of the setpoint programming divider ladder as close as possible to GND (Pin 5) to minimize errors due to IR voltage drops and coupling of external noise sources. In any case, a 0.1 µF capacitor for power supply bypassing is always recommended at the chip. |
|
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |