®

© Coilcraft, Inc. 2012

1102 Silver Lake Road

Cary, IL 60013

Phone 800-981-0363

Fax 847-639-1508

Email cps@coilcraft.com

www.coilcraft-cps.com

This product may not be used in medical or high

risk applications without prior Coilcraft approval.

Specifications subject to change without notice.

Please check our web site for latest information.

6030 POWER INDUCTORS

±20% (µH)

typ

max

min

typ

20°C rise

40°C rise

MS512PYA181MSZ

0.18

1.59

1.75

113

141

39

18.0

24.0

MS512PYA331MSZ

0.33

2.30

2.53

71

89

30

15.0

18.8

MS512PYA561MSZ

0.56

3.01

3.31

49

61

29

12.0

16.5

MS512PYA102MSZ

1.0

5.62

6.18

40

50

23

9.8

13.5

MS512PYA122MSZ

1.2

6.82

7.50

34

43

22

9.0

12.0

MS512PYA182MSZ

1.8

9.57

10.52

27

34

18.2

7.6

10.5

MS512PYA222MSZ

2.2

12.70

13.97

24

30

15.9

5.3

7.5

MS512PYA332MSZ

3.3

19.92

20.81

21

26

12.2

4.5

6.0

1. When ordering, please specify

testing code:

MS512PYA332MSZ

Testing:

Z = COTS

H = Screening per Coilcraft CP-SA-10001

N = Screening per Coilcraft CP-SA-10004

2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.

3. DCR measured on a micro-ohmmeter.

4. SRF measured using an Agilent/HP 4395A or equivalent.

5. Typical dc current at which the inductance drops 30% from its value without current.

6. Typical current that causes the specified temperature rise from 25°C ambient.

7. Electrical specifications at 25°C.

Refer to Doc 362 “Soldering Surface Mount Components” before soldering.

Terminations Tin-lead (63/37) over copper.

Core material Composite

Weight 0.6 – 0.7 g

Ambient temperature –55°C to +105°C with Irms current, +105°C

to +155°C with derated current

Storage temperature Component: –55°C to +155°C.

Tape and reel packaging: –55°C to +80°C

Resistance to soldering heat Max three 40 second reflows at

+260°C, parts cooled to room temperature between cycles

Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /

85% relative humidity)

Enhanced crush-resistant packaging 400/7

″reel

Plastic tape: 16 mm wide, 0.3 mm thick, 12 mm pocket spacing,

3.12 mm pocket depth

■

High temperature materials allow operation in ambient

temperatures up to 155°C

■

Tin-lead (Sn-Pb) termination for the best possible board

adhesion

■

Passes vibration testing to 80 G and shock testing to 1000 G

■

Exceptionally low DCR; soft saturation

Irms Testing

Irms testing was performed on a

0.060

″ thick pcb with 4 oz. copper

traces optimized to minimize

additional temperature rise.

Temperature rise is highly

dependent on many factors

including pcb land pattern,

trace size, and proximity to

other components. Therefore

temperature rise should be

verified in application conditions.

Document MS800-1 Revised 09/17/12