–3–

REV. A

AD8010

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12.6 V

Internal Power Dissipation

2

Plastic Package (N) . . . . . . . Observe Power Derating Curves

Small Outline Package (R) . . Observe Power Derating Curves

Wide Body SOIC (R-16) . . . . Observe Power Derating Curves

Input Voltage (Common-Mode) . . . . . . . . . . . . . . . . . . . .

±V

S

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . .

±1.2 V

Output Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves

Storage Temperature Range N, R . . . . . . . . –65

°C to +125°C

Operating Temperature Range (A Grade) . . . –40

°C to +85°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

8-Lead Plastic Package:

θ

°C/Watt

8-Lead SOIC Package:

θ

°C/Watt

16-Lead SOIC Package:

θ

°C/Watt

AMBIENT TEMPERATURE – C

3.0

2.5

0

–50

2.0

1.5

1.0

0.5

–40 –30 –20 –10

0

10

20

30

40

50

60

70

80

90

8-LEAD SOIC PACKAGE

8-LEAD MINI-DIP PACKAGE

16-LEAD SOIC

PACKAGE (WIDEBODY)

Figure 2. Plot of Maximum Power Dissipation vs. Temperature

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD8010 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Options

AD8010AN

–40

°C to +85°C

8-Lead Plastic DIP

N-8

AD8010AR

–40

°C to +85°C

8-Lead Plastic SOIC

SO-8

AD8010AR-16

–40

°C to +85°C

16-Lead Wide Body SOIC

R-16

AD8010AR-REEL

REEL SOIC

13" REEL

AD8010AR-REEL7

REEL SOIC

7" REEL

AD8010AR-16-REEL

REEL SOIC

13" REEL

AD8010AR-16-REEL7

REEL SOIC

7" REEL

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

AD8010 is limited by the associated rise in junction tempera-

ture. The maximum safe junction temperature for plastic

encapsulated devices is determined by the glass transition tem-

perature of the plastic, approximately +150

°C. Temporarily

exceeding this limit may cause a shift in parametric perfor-

mance due to a change in the stresses exerted on the die by the

package. Exceeding a junction temperature of +175

°C for an

extended period can result in device failure.

While the AD8010 is internally short circuit protected, this

may not be sufficient to guarantee that the maximum junction

temperature (+150

°C) is not exceeded under all conditions. To

ensure proper operation, it is necessary to observe the maximum

power derating curves.