2

Maxim Integrated

MAX44281

Ultra-Small, Ultra-Thin, 4-Bump Op Amp

ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

ELECTRICAL CHARACTERISTICS

VDD to GND............................................................-0.3V to +6V

IN to GND................................................................-0.3V to +6V

OUT to GND.............................. (VGND - 0.3V) to (VDD + 0.3V)

Continuous Power Dissipation (TA = +70NC)

WLP (derate 9.7mW/NC above +70NC) ........................303mW

Maximum Continuous Current into Any Pin ...................P 20mA

Operating Temperature Range........................ -40NC to +125NC

Storage Temperature Range............................ -65NC to +150NC

Soldering Temperature (reflow) ......................................+260NC

WLP

Junction-to-Ambient Thermal Resistance (

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC PERFORMANCE (Note 1)

Input Voltage Range (Note 3)

0.1

0.1

V

0.05

0.1)/2

0.01

0.1)/10

Gain Error

GE

0.01

0.02

%

0.2

0.6

0.3

0.7

Input Offset Voltage (Note 2)

no load

20

100

F

V

20

100

20

100

Input Offset Voltage Drift (Note 2)

2

9

F

V/NC

Input Bias Current (Note 2)

1

10

pA

2000

Output Short-Circuit Current

50

mA

Output Voltage Low

0.02

V

0.1