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AD7112 датащи(PDF) 4 Page - Analog Devices

номер детали AD7112
подробное описание детали  LC2MOS LOGDAC Dual Logarithmic D/A Converter
PDF  12 Pages
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производитель  AD [Analog Devices]
домашняя страница  http://www.analog.com
Logo AD - Analog Devices

AD7112 датащи(HTML) 4 Page - Analog Devices

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AD7112
REV. 0
–4–
ABSOLUTE MAXIMUM RATINGS*
VDD to AGND or DGND . . . . . . . . . . . . . . . . . . –0.3 V, +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
Digital Inputs to DGND . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
OUT A, OUT B to AGND . . . . . . . . . . . –0.3 V, VDD + 0.3 V
VIN A, VIN B to AGND . . . . . . . . . . . . . . . . . . . . . . . . .
±25 V
VRFB A, VRFB B to AGND . . . . . . . . . . . . . . . . . . . . . . . ± 25 V
Operating Temperature Range
All Versions . . . . . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Storage Temperature . . . . . . . . . . . . . . . . . –65
°C to +150°C
Power Dissipation, DIP . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W
θ
JA, Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 102
°C/W
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . +300
°C
Power Dissipation, SOIC . . . . . . . . . . . . . . . . . . . . . . . . . 1 W
θ
JA, Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . . 75
°C/W
Lead Temperature (Soldering)
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability. Only
one Absolute Maximum Rating may be applied at any one time.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7112 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
TERMINOLOGY
RESOLUTION: Nominal change in attenuation when moving
between two adjacent codes.
MONOTONICITY: The device is monotonic if the analog out-
put decreases or remains constant as the wdigital code in-
creases.
FEEDTHROUGH ERROR: That portion of the input signal
which reaches the output when all digital inputs are high.
OUTPUT CAPACITANCE: Capacitance from OUT A or
OUT B to ground.
GAIN ERROR: Gain error results from a mismatch between
RFB (the feedback resistance) and the R-2R ladder resistance.
Its effect in a LOGDAC is to produce a constant additive at-
tenuation error in dB over the whole range of the DAC.
ACCURACY: The difference (measured in dB) between the
ideal transfer function as listed in Table I and the actual trans-
fer function as measured with the device.
DIGITAL-TO-ANALOG GLITCH IMPULSE: The amount
of charge injected from the digital inputs to the analog output
when the inputs change state. This is normally specified as the
area of the glitch in either pA-s or nV-s depending on whether
the glitch is measured as a current or voltage signal. Glitch im-
pulse is measured with VIN = AGND.
ORDERING INFORMATION
Specified
Temperature
Accuracy
Package
Model
Range
Range
Option*
AD7112BN
–40
°C to +85°C
0 dB to 60 dB
N-20
AD7112CN
–40
°C to +85°C
0 dB to 72 dB
N-20
AD7112BR
–40
°C to +85°C
0 dB to 60 dB
R-20
AD7112CR
–40
°C to +85°C
0 dB to 72 dB
R-20
*N = Plastic DIP; R = SOIC.
PIN FUNCTION DESCRIPTION
Pin
Mnemonic
Description
1
AGND
Analog Ground.
2
OUT A
Current Output Terminal of DAC A.
3RFB A
Feedback Resistor for DAC A.
4VIN A
Reference Input to DAC A
5
DGND
Digital Ground.
6
DAC A
/
Selects Which DAC Can Accept Data from
DAC B
Input Port.
7–14 DB7–DB0
8 Data Inputs.
15
CS
Chip Select Input, Active Low.
16
WR
Write Input, Active Low.
17
VDD
Power Supply Input 5 V
± 5%.
18
VIN B
Reference Input to DAC B.
19
RFB B
Feedback Resistor for DAC B.
20
OUT B
Current Output Terminal of DAC B.
PIN CONFIGURATION
DIP/SOIC
AGND
OUT A
DGND
(MSB) DB7
DAC A/DAC B
DB6
DB5
DB4
RFB A
VIN A
OUT B
RFB B
VIN B
VDD
DB0 (LSB)
DB1
DB2
DB3
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
TOP VIEW
(Not to Scale)
AD7112
WR
CS



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