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XC6227 датащи(PDF) 21 Page - Torex Semiconductor |
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XC6227 датащи(HTML) 21 Page - Torex Semiconductor |
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21 / 25 page ![]() 21/25 XC6227 Series ● USP-6C Power Dissipation Board Mount (Tj max = 125℃) Ambient Temperature(℃) Power Dissipation Pd(mW) Thermal Resistance (℃/W) 25 1000 85 400 100.00 て Pd-Ta特性グラフ 0 200 400 600 800 1000 1200 25 45 65 85 105 125 周辺温度Ta(℃) Power dissipation data for the USP-6C is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Pd vs. Ta Ambient Temperature: Ta (℃) ■ PACKAGING INFORMATION (Continued) |
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