4

ACPL-024L/021L SO-8 Package

Solder Reflow Profile

Recommended reflow condition as per JEDEC Standard, J-STD-020 (latest revision). Non-Halide Flux should be used.

Regulatory Information

The ACPL-M21L/024L/021L is approved by the following organizations:

UL

CSA

Approval under CSA Component Acceptance Notice #5.

IEC/EN 60747-5-5 (Option 060 only)

XXXV

YWW

87

6

5

4

3

2

1

5.994 ± 0.203

(0.236 ± 0.008)

3.937 ± 0.127

(0.155 ± 0.005)

0.406 ± 0.076

(0.016 ± 0.003)

1.270

(0.050)

BSC

5.080 ± 0.127

(0.200 ± 0.005)

3.175 ± 0.127

(0.125 ± 0.005)

1.524

(0.060)

45° X

0.432

(0.017)

0.228 ± 0.025

(0.009 ± 0.001)

TYPE NUMBER

(LAST 3 DIGITS)

DATE CODE

0.305

(0.012)

MIN.

0.203 ± 0.102

(0.008 ± 0.004)

7°

PIN ONE

0 ~ 7°

*

* Total package length (inclusive of mold flash)

5.207 ± 0.254 (0.205 ± 0.010)

Dimensions in Millimeters (Inches).

Note: Floating lead protrusion is 0.15 mm (6 mils) max.

Lead coplanarity = 0.10 mm (0.004 inches) max.

Option number 500 not marked.

LAND PATTERN RECOMMENDATION

7.49

(0.295)

1.9

(0.075)

0.64

(0.025)

3.95

(0.156)

1.3

(0.5)