NPN BC107 – BC108 – BC109

25/09/2012

COMSET SEMICONDUCTORS

3/3

THERMAL CHARACTERISTICS

Symbol

Ratings

Value

Unit

Thermal Resistance, Junction to mounting base

500

°C/W

Thermal Resistance, Junction to ambient in free air

200

°C/W

MECHANICAL DATA CASE TO-18

August 2012

         

 

Information furnished is believed to be accurate and reliable. However, Comset Semiconductors assumes no responsibility for the consequences of

use of such information nor for any infringement of patents or other rights of third parties which may results from its use. Data are subject to change

without notice. Comset Semiconductors makes no warranty, representation or guarantee regarding the suitability of its products for any particular

purpose, nor does Comset Semiconductors assume any liability arising out of the application or use of any product and specifically disclaims any and

all liability, including without limitation consequential or incidental damages. Comset Semiconductors’ products are not authorized for use as critical

components in life support devices or systems.

 

 

www.comsetsemi.com

info@comsetsemi.com

DIMENSIONS (mm)

min

max

A

12.7

-

B

-

0.49

C

0.9

-

D

-

5.3

E

-

4.9

F

-

5.8

G

2.54

-

H

-

1.2

I

-

1.16

L

45°

-

Pin 1 :

emitter

Pin 2 :

base

Pin 3 :

Collector

Case :

Collector