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ILX511

Notes on Handling

1) Static charge prevention

CCD image sensors are easily damaged by static discharge. Before handling, be sure to take the following

protective measures.

a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive

shoes.

b) When handling directly use an earth band.

c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.

d) Ionized air is recommended for discharge when handling CCD image sensors.

e) For the shipment of mounted substrates use cartons treated for the prevention of static charges.

2) Notes on handling CCD Cer-DIP package

The following points should be observed when handling and installing this package.

a) (1) Compressive strength:

39N/surface

(Do not apply any load more than 0.7 mm inside the outer perimeter of the glass

portion.)

(2) Shearing strength:

29N/surface

(3) Tensile strength:

29N/surface

(4) Torsional strength:

0.9Nm

b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be

generated and the package may fracture, etc., depending on the flatness of the ceramic portion.

Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.

c) Be aware that any of the following can cause the glass to crack because the upper and lower ceramic

layers are shielded by low-melting glass.

(1) Applying repetitive bending stress to the external leads.

(2) Applying heat to the external leads for an extended period of time with a soldering iron.

(3) Rapid cooling or heating.

(4) Applying a load or impact to a limited portion of the low-melting glass with a small-tipped tool such

as tweezers.

(5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass.

Note that the preceding notes should also be observed when removing a component from a board

after it has already been soldered.

3) Soldering

a) Make sure the package temperature does not exceed 80 °C.

b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded

30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool

sufficiently.

c) To dismount image sensors, do not use a solder suction equipment. When using an electric

desoldering tool, ground the controller. For the control system, use a zero cross type.

Upper ceramic layer

Lower ceramic layer

Low-melting glass

39N

(1)

(4)

(3)

(2)

29N

29N

0.9Nm