© 2010 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSUSB63 • Rev. 1.0.4

10

Physical Dimensions

Figure 18. 12-Lead, Ultrathin Molded Leadless Package (UMLP)

Ordering Information

Part Number Top Mark Operating Temperature Range

Package

FSUSB63UMX

KG

-40 to +85°C

12-Lead, Quad, Ultrathin Molded Leadless Package (UMLP),

1.8mm x 1.8mm x 0.55mm, 0.4mm pitch

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without

notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most

recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty

therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

A

B

C

SEATING

PLANE

RECOMMENDED

LAND PATTERN

NOTES:

A. PACKAGE DOES NOT FULLY CONFORM TO

JEDEC STANDARD.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. LAND PATTERN RECOMMENDATION IS

BASED ON FSC DESIGN ONLY.

E. DRAWING FILENAME: MKT-UMLP12Arev4.

SCALE : 2X

LEAD

OPTION 1

SCALE : 2X

LEAD

OPTION 2

DETAIL A

SCALE : 2X

PIN#1 IDENT

TOP VIEW

BOTTOM VIEW

0.10 C

0.08 C

0.10 C

2X

2X

SIDE VIEW

0.10 C

0.05

0.00

3

6

1

0.10 C A B

0.05 C

0.55 MAX.

12

1.80

1.80

0.40

0.25

0.15(12X)

0.35

0.45

2.10

2.10

0.40

0.563

(11X)

0.20

(12X)

1

0.152

9

0.588

DETAIL A

PIN#1 IDENT

(11X)

PACKAGE

EDGE

0.10

0.10

0.45

0.35

0.10