Package and packing information

STA8088EXG

18/24

Doc ID 022725 Rev. 2

3

Package and packing information

3.1

In order to meet environmental requirements, ST offers these devices in different grades of

3.2

TFBGA169 9 x 9 x 1.2 mm package information

Table 11.

TFBGA169 9 x 9 x 1.2 mm mechanical data

Ref. dim

Data book (mm)

Drawing (mm)

Min.

Typ.

Max.

Min.

Typ.

Max.

1.

TFBGA stands for Thin profile Fine Pitch Ball Grid Array.

- The total profile height (Dim A) is measured from the seating plane to the top of the component

- The maximum total package height is calculated by the following methodology:

A Max = A1 Typ + A2 Typ + A4 Typ +

- Thin profile: 1.00 mm < A

≤ 1.20 mm / Fine pitch: e < 1.00 mm pitch.

1.20

1.07

2.

- The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metallized

markings, or other feature of package body or integral heatslug.

- A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1

corner. Exact shape of each corner is optional.

0.21

0.22

0.27

0.32

A2

0.20

0.16

0.20

0.24

A4

0.585

0.57

0.585

0.60

3.

The typical ball diameter before mounting is 0.35 mm.

0.30

0.35

0.40

0.30

0.35

0.40

D

8.85

9.00

9.15

8.90

9.00

9.10

D1

7.80

7.80

E

9.85

9.00

9.15

8.90

9.00

9.10

E1

7.80

7.80

e

0.65

0.65

Z

0.60

0.60

ddd

0.08

0.08

4.

The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.

For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true

position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball

must lie within this tolerance zone.

0.15

0.15

0.05

0.05