Package information

EMIF02-MIC07F3

6/8

Doc ID 17052 Rev 3

3

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 11.

Flip-Chip package dimensions

Figure 12.

Footprint recommendations

Figure 13.

Marking

1.17 mm ± 30 µm

255 µm ± 40

185 µm

400 µm ± 40

605 µm ± 55

220µm recommended

220µm recommended

260µm maxim um

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

300µm minimum

x

y

x

w

z

w

Dot, ST logo

xx = marking

ECOPAK status

yww = datecode

(y = year

ww = week)

z = manufacturing location