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ECMF06-6AM16 датащи(PDF) 12 Page - STMicroelectronics |
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ECMF06-6AM16 датащи(HTML) 12 Page - STMicroelectronics |
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12 / 16 page ![]() Recommendation on PCB assembly ECMF06-6AM16 12/16 Doc ID 022284 Rev 2 5 Recommendation on PCB assembly 5.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 19. Stencil opening dimensions b) General design rule Stencil thickness (T) = 75 ~ 125 µm 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%. c) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 20. Recommended stencil window position L T W Aspect Ratio W T ----- 1,5 = Aspect Area LW 2T L W + ---------------------------- 0,66 = 180 µm 200 µm 10 µm 30 µm Stencil window Footprint 0.40 0.60 0.20 3.00 1.75 |
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