ST10F276E datasheet(14/235 Pages) STMICROELECTRONICS

14 / 235 page

Introduction

ST10F276E

14/235

Doc ID 12303 Rev 3

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Embedded memory size has been significantly increased (both Flash and RAM).

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PLL multiplication factors have been adapted to new frequency range.

A/D Converter is not fully compatible versus ST10F269 (timing and programming

model). Formula for the conversion time is still valid, while the sampling phase

programming model is different.

Besides, additional 8 channels are available on P1L pins as alternate function: the

accuracy reachable with these extra channels is reduced with respect to the standard

Port5 channels.

●

External Memory bus potential limitations on maximum speed and maximum

capacitance load could be introduced (under evaluation): ST10F276E will probably not

be able to address an external memory at 64MHz with 0 wait states (under evaluation).

●

XPERCON register bit mapping modified according to new peripherals implementation

(not fully compatible with ST10F269).

●

Bondout chip for emulation (ST10R201) cannot achieve more than 50MHz at room

temperature (so no real-time emulation possible at maximum speed).

●

Input section characteristics are different. The threshold programmability is extended to

all port pins (additional XPICON register); it is possible to select standard TTL (with up

to 500mV of hysteresis) and standard CMOS (with up to 800mV of hysteresis).

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Output transition is not programmable.

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CAN module is enhanced: ST10F276E implements two C-CAN modules, so the

programming model is slightly different. Besides, the possibility to map in parallel the

two CAN modules is added (on P4.5/P4.6).

●

On-chip main oscillator input frequency range has been reshaped, reducing it from 1-

25MHz down to 4-12MHz. This is a high performance oscillator amplifier, providing a

very high negative resistance and wide oscillation amplitude: when this on-chip

amplifier is used as reference for Real-Time Clock module, the Power-down

consumption is dominated by the consumption of the oscillator amplifier itself. A metal

option is added to offer a low power oscillator amplifier working in the range of 4-8MHz:

this will allow a power consumption reduction when Real-Time Clock is running in

Power Down mode using as reference the on-chip main oscillator clock.

●

A second on-chip oscillator amplifier circuit (32kHz) is implemented for low power

modes: it can be used to provide the reference to the Real-Time Clock counter (either

in Power Down or Stand-by mode). Pin XTAL3 and XTAL4 replace a couple of VDD/VSS

pins of ST10F269.

●

Possibility to re-program internal XBUS chip select window characteristics (XRAM2 and

XFLASH address window) is added.

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