BAT30F3

PCB recommendations

Doc ID 16915 Rev 2

7/10

To optimize the natural self centering effect of CSP on the PCB, PCB pad positioning and

size have to be properly designed (see Figure 10)

Micro vias

An alternative to routing on the top surface is to route out on buried layers. To achieve this,

the pads are connected to the lower layers using micro vias. Only SSBU via technology is

approved.

Figure 10.

Solder mask opening

370 µm

370 µm

100 µm

450 µm

180 µm

180 µm

255 µm

Non solder mask defined

Solder mask defined