ASX423 datasheet(2/11 Pages) ASB

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ASB Inc. · sales@asb.co.kr · Tel: +82-42-528-7223

September 2011

ASX423

100-4500 MHz MMIC Amplifier

Pin No.

Function

Pin No.

Function.

2nd stage RF IN

GND

1st stage RF OUT

2nd stage RF OUT

GND

2nd stage RF OUT

1st stage RF IN

GND

Mounting Recommendation (in mm)

Outline Drawing

Note: 1. Backside metal paddle is RF and DC ground.

Symbols

Dimensions (In mm)

MIN

NOM

MAX

1.40

1.50

1.60

0.00

---

0.10

---

1.45

---

0.33

---

0.51

0.19

---

0.25

4.80

---

5.00

3.20

3.30

3.40

5.80

6.00

6.20

3.80

3.90

4.00

2.30

2.40

2.50

---

1.27

---

0.40

---

1.27

---

0.10

0°

---

8°

|L1-L1’|

---

0.12

1.04REF

●

Part No.

ESD Classification

HBM

Class 1B

Voltage Level: 500 V~1000 V

Class A

Voltage Level: <200 V

CAUTION: ESD-sensitive device!

Moisture Sensitivity Level (MSL)

Level 3 at 260°C reflow

Note: 1. Add as much copper as possible to inner and outer layers

near the part to ensure optimal thermal performance.

2. To ensure reliable operation, device ground paddle-to-ground

pad soldering is critical.

3. Add mounting screws near the part to fasten the board to a

heat sinker. Ensure that the ground / thermal via region con-

tacts the heat sinker.

4. A proper heat dissipation path underneath the area of the

PCB for the mounted device is strictly required for proper

thermal operation. Damage to the device can result from in-

appropriate heat dissipation.

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