2

Soldering guidelines

The use of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of

the PCB.

The components are suitable for reflow soldering to JEDEC J-STD-020D.

3

Solder joint profiles / solder quantity

3.1

Cement quantity

The component is fixed onto the circuit board with cement prior to soldering. It must still be able

to move slightly. When the board is placed into the reflow oven, excessively rigid fixing can lead

to high forces acting on the component and thus to a break. In addition, too much cement can

lead to unsymmetrical stressing and thus to mechanical fracture of the component. The cement

must also be so soft during mounting that no mechanical stressing occurs.

3.2

Mounting the components on the board

It is best to mount the components on the board before soldering so that one termination does not

enter the oven first and the second termination is soldered subsequently. The ideal case is simul-

taneous wetting of both terminations.

3.3

Solder joint profiles

If the meniscus height is too low, that means the solder quantity is too low, the solder joint may

break, i.e. the component becomes detached from the joint. This problem is sometimes interpret-

ed as leaching of the external terminations.

If the solder meniscus is too high, i.e. the solder quantity is too large, the vise effect may occur.

As the solder cools down, the solder contracts in the direction of the component. If there is too

much solder on the component, it has no leeway to evade the stress and may break, as in a vise.

CeraDiodes

High-speed series

Page 13 of 22

Please read Cautions and warnings and

Important notes at the end of this document.