TLS1255N datasheet(2/7 Pages) TI1

2 / 7 page

TLS1255

VIDEO PREAMPLIFIER SYSTEM

WITH ONSCREEN DISPLAY (OSD) MIXER

SLVS142 − DECEMBER 1996

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

POST OFFICE BOX 1443

• HOUSTON, TEXAS 77251−1443

TLS1255Y chip information

This chip, when properly assembled, displays characteristics similar to the TLS1255. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. The chips may be mounted with

conductive epoxy or a gold silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJ max = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

NO BACKSIDE METALIZATION

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

Supply voltage, VCC (see Note 1)

13.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range, VI (see Note 1)

0 V to VCC

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Video output current, IO (per channel)

28 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Total power dissipation at (or below) 25

°C free-air temperature (see Note 2)

2.37 W

. . . . . . . . . . . . . . . . . . . . .

Operating virtual junction temperature range, TJ

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating free-air temperature range, TA

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. All VCC terminals must be externally wired together to prevent internal damage during VCC power-on/-off cycles.

2. For operation above 25

°C free-air temperature, derate linearly to 1.52 W at the rate of 19 mW/°C.

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