TSC2011

SBAS516

– NOVEMBER 2011

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

DESCRIPTION CONTINUED

The TSC2011 works with supply voltage as low as 1.2V, that can be supplied by a single cell battery. It contains

a complete, ultra low power, 12-bit, A/D resistive touch screen converter including drivers and the control logic to

standard, fast, and high-speed. The TSC2011 is available in a miniture 20-pin 4mmx4mm QFN and a 25-lead

(2.555

±0.055)mm x (2.555±0.055)mm WCSP (with reduced haptic driving specification) packages. The TSC2011

is characterized for the -40

°C to 85°C industrial temperature range.

TYPICAL

NO MISSING

TYPICAL GAIN

INTEGRAL

CODES

PACKAGE

PACKAGE

TEMPERATURE

ORDERING

TRANSPORT MEDIA

MODEL

ERROR

LINEARITY

RESOLUTION

TYPE

DESIGNATOR

RANGE

INFORMATION

QUANTITY

(LSB)

(LSB)

(BIT)

TSC2011IRTJT

Small tape and reel 250

20 Pin 4x4x0.8

TSC2011I

0.8~+1.4

+0.1

11

RTJ

–40°C to 85°C

Thin QFN

TSC2011IRTJR

Tape and reel 3000

25 Pin

TSC2011IYZKT

Small tape and reel 250

TSC2011I

0.8~+1.4

+0.1

11

2.5x2.5x0.65

YZK

(2)

–40°C to 85°C

TSC2011IYZKR

Tape and reel 3000

WCSP

(1)

For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or visit

the device product folder at www.ti.com.

(2)

Product Preview

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

VALUE

UNIT

MIN

MAX

Analog Input X+, Y+, X-, Y-, AUX to GND

−0.4

Voltage range

V

−0.3

5

Digital pin voltage to GND

−0.3

5

V

−40

85

°C

−65

150

°C

150

150

°C

X+, X- , Y+, Y-

±15

kV

X+, X- , Y+, Y-

±25

kV

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to

absolute-maximum rated conditions for extended periods may affect device reliability.

(2)

Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details.

THERMAL INFORMATION

TSC2011

UNITS

RTJ (20 PINS)

YZK (25

Junction-to-ambient thermal resistance

32.1

99.4

Junction-to-case (top) thermal resistance

15.4

5.5

Junction-to-board thermal resistance

5.8

35

°C/W

Junction-to-top characterization parameter

0.2

13

Junction-to-board characterization parameter

5.7

37.7

Junction-to-case (bottom) thermal resistance

1.2

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

Only 18 active pins.

2

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Copyright

© 2011, Texas Instruments Incorporated

Product Folder Link(s): TSC2011