SFH 4232

2009-09-08

7

Empfohlenes Lötpaddesign

Recommended Solder Pad Design

Solder resist

Freies Kupfer

Bare Copper

Lötpasten Schablone

Solder paste stencil

Lötstopplack

OHAY0681

Kupfer

Copper

1.6 (0.063)

11.6 (0.457)

12.0 (0.472)

1.6 (0.063)

11.6 (0.457)

3 Lötstellen

3 solder points

Thermal enhanced PCB

Thermisch optimiertes PCB

ø4.0 (0.157)

Heatsink attach

ø4.0 (0.157)

ø2.5 (0.098)

Achtung:

Anode und Heatsink sind elektrisch verbunden

Attention:

Anode and Heatsink are electrically connected

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