SP4423DS/14

SP4423 Electroluminescent Lamp Driver

© Copyright 2000 Sipex Corporation

2

ABSOLUTE MAXIMUM RATINGS

These are stress ratings only and functional operation of the device at

these ratings or any other above those indicated in the operation sections

of the specifications below is not implied. Exposure to absolute maximum

rating conditions for extended periods of time may affect reliability.

V

Input Voltages/Currents

HON (pin1).........................................-0.5V to (V

COIL (pin3)..............................................................60mA

Lamp Outputs..............................................................................230V

PP

Storage Temperature....................................................-65˚C to +150˚C

Power Dissipation Per Package

8-pin

The information furnished herein by Sipex has been carefully reviewed

for accuracy and reliability. Its application or use, however, is solely the

responsibility of the user. No responsibility for the use of this information

is assumed by Sipex, and this information shall not explicitly or implicitly

become part of the terms and conditions of any subsequent sales

agreement with Sipex. Specifications are subject to change without

prior notice. By the sale or transfer of this information, Sipex assumes

no responsibility for any infringement of patents or other rights of third

parties which may result from its use. No license or other proprietary

rights are granted by implication or otherwise under any patent or

patent rights of Sipex Corporation.

This data sheet specifies environmental parameters, final test conditions and limits as well suggested operating conditions.

For applications which require performance beyond the specified conditions and or limits please consult the factory.

COIL

V

SS

V

DD

EL 1

EL 2

CAP 1

CAP 2

HON

SP4423

537A

PAD

X

Y

EL1

556.5

179.0

EL2

556.2

-151.0

COIL

-19.5

-517.0

-568.0

-517.0

HON

-549.0

-256.5

CAP2

-549.0

93.5

CAP1

-568.0

-516.5

-349.0

517.0

NOTES:

1. Dimensions are in Microns unless otherwise noted.

2. Bonding pads are 125x125 typical

3. Outside dimensions are maximum, including scribe area.

4. Die thickness is 10 mils +/- 1.

5. Pad center coordinates are relative to die center.

6. Die size 1447 x 1346 ( 57 x 53 mils).

Bonding Diagram:

R

E

T

E

M

A

R

A

P.

N

I

M.

P

Y

T.

X

A

MS

T

I

N

US

N

O

I

T

I

D

N

O

C

V

,

e

g

a

t

l

o

V

y

l

p

p

u

S

D

D

2

.

20

.

30

.

6V

,

t

n

e

r

r

u

C

y

l

p

p

u

SI

L

I

O

C

I

+

D

D

5

2

1

2

1

0

4

A

m

V

D

D

V

,

V

0

.

3

=

N

O

H

V

0

.

3

=

V

D

D

V

,

V

0

.

6

=

N

O

H

V

0

.

6

=

V

,

e

g

a

t

l

o

V

li

o

C

L

I

O

C

V

D

D

0

.

6

V

V

,

e

g

a

t

l

o

V

t

u

p

n

I

N

O

H

N

O

H

f

f

o

L

E

:

W

O

L

n

o

L

E

:

H

G

I

H

5

2

.

0

-

V

D

D

5

2

.

0

-

0

V

D

D

V

5

2

.

0

V

D

D

5

2

.

0

+

V

n

o

L

E

,

t

n

e

r

r

u

C

N

O

H5

2

0

5

0

6

0

2

1

µA

V

N

O

H

V

=

D

D

V

0

.

3

=

V

N

O

H

V

=

D

D

V

0

.

6

=

I

,

t

n

e

r

r

u

C

n

w

o

d

t

u

h

S

D

S

I

=

L

I

O

C

I

+

D

D

0

1

3

.

0

0

0

2

1

A

n

µA

V

D

D

V

,

V

0

.

3

=

N

O

H

V

0

=

V

D

D

V

,

V

0

.

6

=

N

O

H

V

0

=

E

V

I

R

D

R

O

T

C

U

D

N

I

f

,

y

c

n

e

u

q

e

r

F

li

o

C

L

I

O

C

f

=

P

M

A

L

2

3

x6

.

9z

H

k

e

l

c

y

C

y

t

u

D

li

o

C5

7%

I

,

t

n

e

r

r

u

C

li

o

C

k

a

e

P

L

I

O

C

-

K

P

0

6A

m.

n

g

i

s

e

d

y

b

d

e

e

t

n

a

r

a

u

G

T

U

P

T

U

O

P

M

A

L

L

E

f

,

y

c

n

e

u

q

e

r

F

p

m

a

L

L

E

P

M

A

L

0

0

2

5

2

2

0

0

3

0

0

3

0

0

4

0

5

4

z

H

V

D

D

V

0

.

3

=

V

D

D

V

0

.

6

=

e

g

a

t

l

o

V

t

u

p

t

u

O

k

a

e

P

o

t

k

a

e

P0

1

10

5

1V

P

P

SPECIFICATIONS

(T= 25

°C; V

V

DD

V

SS