TLE 4261

Semiconductor Group

18

1998-11-01

Package Outlines (cont’d)

110

11

20

Index Marking

1) Does not include plastic or metal protrusions of 0.15 max per side

2) Does not include dambar protrusion of 0.05 max per side

GPS05094

0.1

+0.15

0.35

1.27

2)

0.2 24x

-0.2

7.6

1)

0.35 x 45˚

+0.8

±0.3

10.3

0.4

1)

P-DSO-20-6

(Plastic Dual Small Outline)

Weight approx. 0.6 g

Sorts of Packing

Package outlines for tubes, trays etc. are contained in our

Data Book “Package Information”.

Dimensions in mm

SMD = Surface Mounted Device