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MICRF610Z датащи(PDF) 18 Page - Micrel Semiconductor |
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MICRF610Z датащи(HTML) 18 Page - Micrel Semiconductor |
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18 / 20 page ![]() Micrel, Inc. MICRF610/MICRF610Z July 2006 18 M9999-120205 Application Circuit Illustration Figure 11. Circuit illustration of MICRF610, LDO and MCU Figure 11 shows a typical set-up with the MICRF610, a Low-Drop-Out voltage regulator (LDO) and a mikro- controller (MCU). When the MICRF610 and the MCU runs on the same power supply (min 2.0, max. 2.5V), the IO can be connected directly to the MCU. If the MCU needs a higher VDD than the max. specified VDD of the MICRF610 (2.5V), voltage dividers need to be added on the IO lines not to override the max. input voltage. Figure 12 shows a recommended voltage divider circuit for a MCU running at 3.0V and the MICRF610 at 2.5V. 3k3 18k 3k3 18k 3k3 18k 15k MICRF6xx MCU CS SCLK IO DATAIXO DATACLK LD RSSI CS SCLK IO DATAIXO DATACLK LD RSSI Figure 12. How to connect MICRF610 (2.5V) and MCU (3.0V) Assembling the MICRF610 Recommended Reflow Temperature Profile When the MICRF610 module is being automatically assembled to a PCB, care must be taken not to expose the module for temperature above the maximum specified. Figure 13 shows the recommended reflow temperature profile. Figure 13. Recommended Reflow Temperature Reflow Shock/Vibration during Reflow The module has several components inside which are assembled in a reflow process. These components may reflow again when the module is assembled onto a PCB. It is therefore important that the module is not subjected to any mechanical shock or vibration during this process. Handassembling the MICRF610 It is recommended to use solder paste also during hand assembling of the module. Because of the module ground pad on the bottom side, the module will be assembled most efficient if the heat is being subjected to the bottom side of the PCB. The heat will be transferred trough the PCB due the ground vias under the module (see Layout Considerations). In addition, it is recommended to use a solder tip on the signal and power pads, to make sure the solder points are properly melted. |
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