1

Application Note on Sample Board Operation of the

MASW-000822-12770T T/R Switch

Rev 1

MASW-000822-000SMB

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Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

ADVANCED:

Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

The following is an application guide for

utilization of the MASW-000822-12770T

in conjunction with a supplied sample

board from M/ACOM Tech. The guide will

review the operation of the T/R using a

single positive supply as well as other

optional dual polarity supplies.

The

MASW-000822-12770T

is

a

T/R

switch with two PIN diodes in series in a

common

anode

configuration.

The

switch die along with matching compo-

nents are mounted in a standard 3mm

MLP 16 lead package (Figure 1). The

switch die utilizes M/ACOM Technology

Solutions patented HMIC

 process. The

backside of the switch die is thermally

grounded while being electrically iso-

lated. The excellent power handling of

the die is achieved through specific

techniques using unique thermal con-

ductive epoxy embedded in the die. This

allows the heat to be transferred from

the series connected device to ground

while maintaining electrical isolation.

The large backside of the pad of the

package is both thermal and electrical

ground. Figure 2 shows the electrical/

thermal schematic of the device.

The sample board is made of Rogers

RO4350 material 10mils thick dielectric

with a added layers to increase the

board thickness to 62mils for handling,

rigidity and connector mounting. There

are on-board bias networks incorporated

to accommodate biasing the device with-

out the use of expensive external bias

tees. Figure 3 shows the standard board

layout with component selection for op-

timize performance up to 6 GHz.

Figure 1.

Figure 2. Electrical/Thermal Schematic