CR-15 Package Handling and Mounting Procedure

Rev. V5

Application Note

M567

2

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

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Mounting Hardware / Torque Sequence

Size #2 socket head cap screws and medium split lock

washers are recommended.

The mounting hardware

should initially be installed finger tight (approximately 4

inch-ounces), followed by a controlled torque of 48 inch-

ounces , in an alternating torque sequence. The use of

two

separate calibrated

torque screw drives is

recommended for this purpose, especially in high volume

applications. Manual drive is acceptable, but electric or

pneumatic drive torque tools are preferred to minimize

operator fatigue. Incorrect installation torque may cause

inconsistent electrical and thermal performance and lead

to device failure.

Package Lead Soldering

Recommendations

A 63/37 tin/lead eutectic is the preferred solder for pre-

tinning and attaching the package lead to the

surrounding circuit board. Since the typical thickness of

gold plating on the package leads is 50 micro-inches

minimum, pre-tinning of the package leads may be

necessary to reduce gold embrittlement in the solder

joint.

Pre-tinning will result in the highest reliability

connection, especially when solder volumes are

relatively low. The necessity to pre-tin will depend on the

particular application and the soldering equipment being

used.

For applications where surface mount components are to

be installed after the CR-15 installation, this package will

not be damaged when subjected to typical convection or

IR over reflow profiles. M/A-COM Tech Application Note

M538 may be used as a guide for maximum allowable

reflow time and temperature.

Alternatively, the package leads may be individually

soldered.

Whether an iron or hot gas soldering

equipment is used, care should be take to insure that the

temperature is well controlled and the assembly

environment is electric static discharge (ESD) safe.