AD7944 datasheet(9/28 Pages) AD

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ADA4896-2/ADA4897-1

Rev. 0 | Page 9 of 28

ABSOLUTE MAXIMUM RATINGS

The quiescent power is the voltage between the supply pins (VS)

multiplied by the quiescent current (IS).

Table 6.

Parameter

Rating

Supply Voltage

11 V

Power Dissipation

See Figure 3

Common-Mode Input Voltage

−VS − 0.7 V to +VS + 0.7 V

Differential Input Voltage

±0.7 V

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +125°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

PD = Quiescent Power + (Total Drive Power – Load Power)

()

OUT

–

⎟⎟

⎠

⎞

⎜⎜

⎝

⎛

RMS output voltages should be considered. If RL is referenced to

−VS, as in single-supply operation, the total drive power is VS ×

IOUT. If the rms signal levels are indeterminate, consider the

worst case, when VOUT = VS/4 for RL to midsupply.

() (

)

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

In single-supply operation with RL referenced to −VS, worst case

is VOUT = VS/2.

Airflow increases heat dissipation, effectively reducing θJA.

Also, more metal directly in contact with the package leads and

exposed paddle from metal traces, through holes, ground, and

power planes, reduces θJA.

THERMAL RESISTANCE

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the dual 8-lead LFCSP

(61°C/W), the dual 8-lead MSOP (222°C/W), the single 8-lead

SOIC (133°C/W), and the single 6-lead SOT-23 (306°C/W) on a

JEDEC standard 4-layer board. θJA values are approximations.

θJA is specified for the worst-case conditions, that is, θJA is

specified for a device soldered in a circuit board for surface-

mount packages. Table 7 lists the θJA for the ADA4896-2/

ADA4897-1.

Table 7. Thermal Resistance

0.5

1.0

1.5

2.0

2.5

3.0

3.5

–45 –35 –25 –15 –5

15 25 35 45 55 65 75 85 95 105 115 125

AMBIENT TEMPERAURE (°C)

6-LEAD SOT-23

8-LEAD MSOP

8-LEAD SOIC

8-LEAD LFCSP

TJ = 150°C

Package Type

θJA

Unit

8-Lead Dual MSOP (ADA4896-2)

222

°C/W

8-Lead Dual LFCSP (ADA4896-2)

°C/W

8-Lead Single SOIC (ADA4897-1)

133

°C/W

6-Lead Single SOT-23 (ADA4897-1)

306

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the ADA4896-2/

ADA4897-1 is limited by the associated rise in junction

temperature (TJ) on the die. At approximately 150°C, which

is the glass transition temperature, the properties of the plastic

change. Even temporarily exceeding this temperature limit may

change the stresses that the package exerts on the die, perma-

nently shifting the parametric performance of the ADA4896-2/

ADA4897-1. Exceeding a junction temperature of 175°C for an

extended period of time can result in changes in silicon devices,

potentially causing degradation or loss of functionality. The

power dissipated in the package (PD) is the sum of the quiescent

power dissipation and the power dissipated in the die due to the

ADA4896-2/ADA4897-1 drive at the output.

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

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