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©2011 Littelfuse, Inc.

Specifications are subject to change without notice.

Revision: June 27, 2011

SP6002 Series

ESD and EMI Filter Devices - SP6002 Series

Line Capacitance vs. DC Bias

0

10

20

30

40

50

60

DC Bias (V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Time

25

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Critical Zone

Critical Zone

Reflow Condition

Pb – Free assembly

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (min to max) (t

60 – 180 secs

Average ramp up rate (Liquidus) Temp

(T

3°C/second max

T

3°C/second max

Reflow

-Temperature(T

217°C

-Temperature(t

60 – 150 seconds

PeakTemperature(T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peakTemperature (T

8 minutes Max.

Do not exceed

260°C

Soldering Parameters

Product Characteristics

Lead Plating

Pre-Plated Frame

Lead Material

Copper Alloy

Lead Coplanarity

0.0004 inches (0.102mm)

Subsitute Material

Silicon

Body Material

Molded Epoxy

Flammability

UL94-V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. All specifications comply to JEDEC SPEC MO-223 Issue A

5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

6. Package surface matte finish VDI 11-13.

Ordering Information

Part Number

Package

Size

Marking

Min. Order Qty.

SP6002-04UTG-1

uDFN-08

1.7x1.35mm

KH4

3000

SP6002-06UTG-1

uDFN-12

2.5x1.35mm

KH6

3000

Part Numbering System

Part Marking System

SP 6002 0x U T G -1

Series

Package

UDFN-08 (1.7x1.35mm)

UDFN-12 (2.5x1.35mm)

T= Tape & Reel

G= Green

Number of Channels

04 = 4 Channel UDFN-08

06 = 6 Channel UDFN-12

–

Family of TVS Diode Arrays

KH4

KH6

J H x

Product Series

K = SP6002

Assembly Site

4 = UDFN-08

6 = UDFN-12