SMT80C2 datasheet(16/20 Pages) EMERSON-NETWORKPOWER

16 / 20 page

Rev. 04.25.11

SIL/SMT80C2

16 of 20

Embedded Power for

Business-Critical Continuity

Technical Reference Note

MechanicalDrawings

SIL80C-00SADJ-VJ

Footprint

2.54

21 PLACES

1.27

.050

.100

TYP

2.300 58.42

.050

TYP

1.27

APPLY LIQUI-BOND BETWEEN HEATSINK

AND PCB. ADJUST APPLICATION STENCIL TO

KEEP EXCESS LIQUI-BOND TO A MINIMUM

SCALE: 3 = 2

SIZE

CAD FILE:

DWG. NO.

SHEET 1 OF 2

TLA DRAWING

APPROVALS

DRAWN

ENGINEER

UNLESS OTHERWISE SPECIFIED

DIMENSIONS ARE IN INCHES

TOLERANCES:

2 PLACE

3 PLACE

ANGLES

.03

MATERIAL

FINISH

ARTESYN TECHNOLOGIES

EDEN PRAIRIE, MN 55433

PH. 952-941-1100

REV.

PROJECT USED ON:

7091259-0000

TITLE:

UPPERCUT 80

THIRD

ANGLE

PROJECTION

DATE

.015

HOLE TOLERANCE: .005

M. HENNIES

20JUN06

DETACHED LIST

7001259-J000

NOTE:

1. 9300161-0000 PACKAGING AND MATERIAL HANDLING PROCEDURE.

2. COSMETIC AND WORKMANSHIP PER 9300152-0000.

3. LABELS SHOWN FOR PLACEMENT REFERENCE ONLY.

.040 1.02

58.93

2.320

1.160 29.46

31.75

1.250

60.96

2.400

.050

TYP

1.27

(23X)

±.002 0.64

SQ PINS

17.53 MAX

.690

1.57

.062

REF

2.79

.110

REF

±0.05

REF .025

.140

TYP

3.56

PART NUMBER

REV

DESCRIPTION

DRAFT

DATE

7091259-0000

RELEASE TO PRODUCTION

M. HENNIES

03/08/07

REVISION RECORD

Pin 1

3.30

.130

4.88

.192

.242 6.15

.730 18.54

FOOTPRINT

KEEP OUT AREA

PCB OUTLINE

THROUGH HOLE

.040" DIA (23X)

Ø 0.45 ±.003

[1.14 ±0.08]

23x

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