MAX15070A datasheet(2/9 Pages) MAXIM

2 / 9 page

7A Sink, 3A Source,

12ns, SOT23 MOSFET Drivers

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

(Voltages referenced to GND.)

V+, IN+, IN- .......................................................... -0.3V to +16V

N_OUT, P_OUT ...........................................-0.3V to (V+ + 0.3V)

N_OUT Continuous Output Current (Note 1) ................. -200mA

P_OUT Continuous Output Current (Note 1) ................ +125mA

Continuous Power Dissipation (TA = +70NC)

SOT23 (derate 8.7mW/NC above +70NC).................. 696mW*

Operating Temperature Range ...................... -40NC to +125NC

Junction Temperature ................................................... +150NC

Storage Temperature Range........................... -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

ELECTRICAL CHARACTERISTICS

(V+ = +12V, CL = 0F, TA = TJ = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC. Parameters specified at

V+ = +4.5V apply to the MAX15070A only; see Figure 1.) (Note 3)

ABSOLUTE MAXIMUM RATINGS

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

SOT23

Junction-to-Ambient Thermal Resistance (BJA) ........115NC/W

Junction-to-Case Thermal Resistance (BJC) .................. 80NC/W

PACKAGE THERMAL CHARACTERISTICS (Note 2)

*As per JEDEC 51 standard.

Note 1: Continuous output current is limited by the power dissipation of the package.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY (V+)

Input Voltage Range

MAX15070A

MAX15070B

Undervoltage Lockout

VUVLO V+ rising

3.3

3.45

3.6

Undervoltage-Lockout

Hysteresis

200

Undervoltage Lockout to Output

Rising Delay

V+ rising

100

Undervoltage Lockout to Output

Falling Delay

V+ falling

Supply Current

IV+

V+ = 14V, no switching

0.5

V+ = 14V, switching at 1MHz

2.3

n-CHANNEL OUTPUT (N_OUT)

N_OUT Resistance

RN_OUT

V+ = +12V,

IN_OUT = -100mA

TA = +25NC

0.256

0.32

TA = +125NC

0.45

V+ = +4.5V,

IN_OUT = -100mA

TA = +25NC

0.268

0.33

TA = +125NC

0.465

Power-Off Pulldown Resistance

V+ = unconnected, IN_OUT = -1mA, TA = +25NC

1.3

1.9

Output Bias Current

IBIASN

VN_OUT = V+

Peak Output Current

IPEAKN CL = 22nF

7.0

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