Document Number: 28747

www.vishay.com

Revision: 06-May-10

3

MFU Series

Thin Film Chip Fuses

Vishay Beyschlag

DIMENSIONS

SOLDER PAD DIMENSIONS

Note

• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in

publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other

parameters.

DIMENSIONS - Chip fuse types, mass and relevant physical dimensions

TYPE

H

(mm)

L

(mm)

W

(mm)

(mm)

(mm)

(mm)

MASS

(mg)

MFU 0402

0.32 ± 0.07

1.0 ± 0.05

0.5 ± 0.05

> 75 % of W

0.2 + 0.1/- 0.15

0.2 ± 0.1

0.65

MFU 0603

0.45 + 0.1/- 0.05

1.55 ± 0.05

0.85 ± 0.1

> 75 % of W

0.3 + 0.15/- 0.2

0.3 + 0.15/- 0.2

1.9

MFU 0805

0.45 + 0.1/- 0.05

2.0 ± 0.1

1.25 ± 0.15

> 75 % of W

0.4 + 0.1/- 0.2

0.4 + 0.1/- 0.2

4.7

MFU 1206

0.55 ± 0.1

3.2 + 0.1/- 0.2

1.6 ± 0.15

> 75 % of W

0.5 ± 0.25

0.5 ± 0.25

9.5

RECOMMENDED SOLDER PAD DIMENSIONS

TYPE

WAVE SOLDERING

REFLOW SOLDERING

G

(mm)

Y

(mm)

X

(mm)

Z

(mm)

G

(mm)

Y

(mm)

X

(mm)

Z

(mm)

MFU 0402

-

-

-

-

0.35

0.55

0.55

1.45

MFU 0603

0.55

1.10

1.10

2.75

0.65

0.70

0.95

2.05

MFU 0805

0.80

1.25

1.50

3.30

0.90

0.90

1.40

2.70

MFU 1206

1.40

1.50

1.90

4.40

1.50

1.15

1.75

3.80

T

2

T

1

L

H

W

W

T

G

X

Y

Z