EMIF06-MSD02N16

Package information

7/12

4

Package information

●

Epoxy meets UL94, V0

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Table 3.

Micro QFN 3.5x1.2 16L dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

0.45

0.50

0.55

0.018 0.020 0.022

A1

0.00

0.05

0.000

0.002

b

0.15

0.20

0.25

0.006 0.008 0.010

b1

0.25

0.30

0.35

0.010 0.012 0.014

D

3.45

3.50

3.55

0.136 0.138 0.140

D2

2.70

2.80

2.90

0.106 0.110 0.114

E

1.15

1.20

1.25

0.045 0.047 0.049

E2

0.25

0.30

0.40

0.010 0.012 0.016

e

0.40

0.016

k

0.20

0.008

L

0.20

0.25

0.30

0.008 0.010 0.012

L1

0.15

0.006

M

0.20

0.008

Figure 13.

Micro QFN 3.5x1.2 16L

footprint (dimensions in mm)

Figure 14.

Marking

1

1

Pin 1

Index area

A

A1

L

L1

M

b1

b

e

k

E2

E

D

D2

0.30

0.45

0.20

0.40

1.6

0.70

2.30

3.00

N6

Dot : Pin 1 Identification

N6 = Marking