www.vishay.com

For technical questions within your region, please contact one of the following:

Document Number: 88546

4

Revision: 15-Mar-11

This datasheet is subject to change without notice.

BYM10-50 thru BYM10-1000, GL41A thru GL41Y

Vishay General Semiconductor

Fig. 5 - Typical Junction Capacitance

Fig. 6 - Typical Transient Thermal Impedance

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

1

10

100

10

1

100

Reverse Voltage (V)

T

f = 1.0 MHz

V

0.01

0.1

10

1

100

0.1

10

100

1

Mounted on 0.20" x 0.27" (5 mm x 7 mm)

Copper Pad Areas

(

t - Pulse Duration (s)

DO-213AB

1

Solderable Ends

D2 = D1

+ 0

- 0.008 (0.20)

D2

0.105 (2.67)

0.095 (2.41)

D1 =

0.022 (0.56)

0.018 (0.46)

0.022 (0.56)

0.018 (0.46)

0.205 (5.2)

0.185 (4.7)

Mounting Pad Layout

0.138 (3.5) MAX.

0.049 (1.25) MIN.

0.238 (6.0) REF.

0.118 (3.0) MIN.