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Document Number: 94109

2

Revision: 08-Jul-08

8EWF..SPbF Soft Recovery Series

Vishay High Power Products

Surface Mountable

Fast Soft Recovery Diode, 8 A

Note

For recommended footprint and soldering techniques refer to application note #AN-994

ELECTRICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Maximum forward voltage drop

1.3

V

Forward slope resistance

25.6

m

Ω

Threshold voltage

0.93

V

Maximum reverse leakage current

0.1

mA

4

RECOVERY CHARACTERISTICS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Reverse recovery time

25 A/µs

270

ns

Reverse recovery current

4.2

A

Reverse recovery charge

1µC

Snap factor

S

0.6

I

FM

t

rr

di

dt

I

rr

Q

rr

t

t

a

t

b

THERMAL - MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Maximum junction and

storage temperature range

- 40 to 150

°C

Maximum thermal resistance,

junction to case

DC operation

2.5

°C/W

Typical thermal resistance,

junction to ambient (PCB mount)

50

Soldering temperature

For 10 seconds

240

°C

Approximate weight

1g

0.03

oz.

Marking device

Case style D-PAK (TO-252AA)

8EWF12S