For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

8

8 - 4

Outline Drawing

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.

5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO

PCB RF GROUND.

Part Number

Package Body Material

Lead Finish

MSL Rating

HMC739LP4

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

H739

XXXX

HMC739LP4E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H739

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

HMC739LP4 / 739LP4E

v03.0309

MMIC VCO w/ HALF FREQUENCY OUTPUT

& DIVIDE-BY-16, 23.8 - 26.8 GHz

Pin Descriptions

Pin Number

Function

Description

Interface Schematic

1, 3, 5, 6, 7, 8,

9, 12, 13, 14, 18,

19, 21, 23, 24

N/C

No Connection required. These pins may be connected

to RF/DC ground without affecting performance.

2

RFOUT/16

RF/16 Divided Output. Requires DC Block.

4

Vcc (DIG)

Supply voltage for prescaler.

Can be omitted if prescaler is not needed to conserve

approximately 100 mA