For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

10

10 - 5

HMC666LP4 / 666LP4E

v02.1010

BiCMOS MMIC MIXER W/ INTEGRATED

LO AMPLIFIER, 3.1 - 3.9 GHz

Outline Drawing

Part Number

Package Body Material

Lead Finish

MSL Rating

HMC666LP4

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

H666

XXXX

HMC666LP4E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H666

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

NOTES:

1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED

PLASTIC SILICA AND SILICON IMPREGNATED.

2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.

3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.

4. DIMENSIONS ARE IN INCHES [MILLIMETERS].

5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

6. PAD BURR LENGTH SHALL BE 0.15mm MAX.

PAD BURR HEIGHT SHALL BE 0.25mm MAX.

7. PACKAGE WARP SHALL NOT EXCEED 0.05mm

8. ALL GROUND LEADS AND GROUND PADDLE

MUST BE SOLDERED TO PCB RF GROUND.

9. REFER TO HITTITE APPLICATION NOTE

FOR SUGGESTED PCB LAND PATTERN.