4

4 - 35

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Pad Number

Function

Description

Interface Schematic

1, 4, 7

RF1, RFC, RF2

This pin is DC coupled and matched to 50 Ohm. Blocking

capacitors are required if RF line potential is not equal to 0V.

2, 10

B

See truth table and control voltage table.

Alternate A & B control pads provided.

3, 11

B

5, 8

A

6, 9

A

Die Bottom

GND

Die bottom must be connected to RF ground.

Outline Drawing

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. DIE THICKNESS IS .004”

3. TYPICAL BOND PAD IS .004” SQUARE

4. BACKSIDE METALIZATION: GOLD

5. BACKSIDE METAL IS GROUND

6. BOND PAD METALIZATION: GOLD

7. NO CONNECTION REQUIRED FOR UNLABLED BOND PADS.

8. OVERALL DIE SIZE ±.002”

Pad Descriptions

HMC607

GaAs MMIC HIGH ISOLATION

SPDT SWITCH, DC - 15 GHz

v04.0809

Standard

Alternate

WP-17 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.