11

ICS9220

1227G—11/05/07

Thermal Characteristics

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

θ

JA

Still air

120

°C/W

θ

JA

1 m/s air flow

95

°C/W

θ

JA

3 m/s air flow

80

°C/W

Thermal Resistance Junction to Case

θ

JC

20

°C/W

Thermal Resistance Junction to Top of

Case

Ψ

JT

Still Air

4.5

°C/W

Maximum Case Temp

120

°C

Thermal Resistance Junction to

Ambient

SYMBOL

CONDITION

MIN

TYP

MAX

UNITS

910

11

ns

2

185

ps

over 10,000 cycles

40

60

%

20% to 80% of input voltage

175

700

ps

20% to 80% of input voltage

-

150

ps

3

30

33

kHz

Triangular modulation

0.6

%

Non-triangular modulation

0.54

%

20% to 80% of input voltage

1

4

V/ns

CLK_INT, CLK_INC

7

pF

10

pF

Bypass Mode

4

40

ns

10

100

kHz

Notes:

1

2

3

4

5

Input clock slew rate

Input Capacitance

5

CLK_INT/CLK_INC rise and fall time

Difference between input rise and fall

time on same pin of a single device

Spread spectrum modulation frequency

Input clock duty cycle

Cycle-to-Cycle Jitter

AC Characteristics-Inputs

PARAMETER

CLK_INT/CLK_INC cycle time

1

Capacitance measured at f = 1 MHz, DC bias = 0.9V, VAC <100mV.

3

Measured at crossing points for differential clock input or at VTH for single- ended clock input.

If input modulation is used. Input modulation is not necessary.

The amount of allowed spreading for non-triangular modulation is determined by the induced downstream

tracking skew.

Spread spectrum modulation index

SMBus clock frequency

CLK_INT cycle time

Input Capacitance

5