For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

11

11 - 70

Outline Drawing

Absolute Maximum Ratings

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE

SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED

LAND PATTERN.

Collector Bias Voltage (Vcc)

+5Vdc

Control Voltage (Vpd)

+3.5 Vdc

RF Input Power (RFIN)(Vs = Vpd = +3.0 Vdc)

+13 dBm

Junction Temperature

150 °C

Continuous Pdiss (T = 85 °C)

(derate 17 mW/°C above 85 °C)

1.105 W

Thermal Resistance

(junction to ground paddle)

59 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC415LP3

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

415

XXXX

HMC415LP3E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

415

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information

GaAs InGaP HBT MMIC

POWER AMPLIFIER, 4.9 - 5.9 GHz

v03.0605

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS