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MAX19985A датащи(PDF) 2 Page - Maxim Integrated Products

номер детали MAX19985A
подробное описание детали  Dual, SiGe, High-Linearity, 700MHz to 1000MHz Downconversion Mixer with LO Buffer/Switch
PDF  23 Pages
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производитель  MAXIM [Maxim Integrated Products]
домашняя страница  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX19985A датащи(HTML) 2 Page - Maxim Integrated Products

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Dual, SiGe, High-Linearity, 700MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit, VCC = 3.0V to 3.6V, TC = -40°C to +85°C. Typical values are at VCC = 3.3V, TC = +25°C, all parameters
are guaranteed by design and not production tested, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Based on junction temperature TJ = TC + (
θJC x VCC x ICC). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the
Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: Junction temperature TJ = TA + (
θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Note 4: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
VCC to GND ...........................................................-0.3V to +5.5V
LO1, LO2 to GND ...............................................................±0.3V
Any Other Pins to GND...............................-0.3V to (VCC + 0.3V)
RFMAIN, RFDIV, and LO_ Input Power ..........................+15dBm
RFMAIN, RFDIV Current (RF is DC shorted
to GND through balun)....................................................50mA
Continuous Power Dissipation (Note 1) ..............................8.8W
θJA (Notes 2, 3)..............................................................+38°C/W
θJC (Note 3).....................................................................7.4°C/W
Operating Temperature Range (Note 4) .....TC = -40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
VCC
R2 = R5 = 600
Ω
3.0
3.3
3.6
V
Supply Current
ICC
Total supply current, VCC = 3.3V
280
mA
LOSEL Input High Voltage
VIH
2V
LOSEL Input Low Voltage
VIL
0.8
V
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit, VCC = 4.75V to 5.25V, TC = -40°C to +85°C. Typical values are at VCC = 5.0V, TC = +25°C, all parame-
ters are production tested, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
VCC
4.75
5
5.25
V
Supply Current
ICC
330
380
mA
LOSEL Input High Voltage
VIH
2V
LOSEL Input Low Voltage
VIL
0.8
V
LOSEL Input Current
IIH, IIL
-10
+10
µA



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