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MAX13442E датащи(PDF) 2 Page - Maxim Integrated Products |
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MAX13442E датащи(HTML) 2 Page - Maxim Integrated Products |
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2 / 18 page ![]() ±15kV ESD-Protected, ±80V Fault-Protected, Fail-Safe RS-485/J1708 Transceivers 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Voltages referenced to GND.) VCC ........................................................................................+7V RE, DE, DE, DI, TXD ...................................-0.3V to (VCC + 0.3V) A, B (Note 1) (MAX13442E/MAX13444E) ............................±80V A, B (Note 1) (MAX13443E) .................................................±60V RO ..............................................................-0.3V to (VCC + 0.3V) Short-Circuit Duration (RO, A, B) ...............................Continuous Continuous Power Dissipation (TA = +70°C) SO (derate 7.6mW/°C above +70°C) ...........................606mW Operating Temperature Range .........................-40°C to +125°C Storage Temperature Range .............................-65°C to +150°C Junction Temperature ......................................................+150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C PACKAGE THERMAL CHARACTERISTICS (Note 2) SO Junction-to-Ambient Thermal Resistance ( θJA) .........132°C/W Junction-to-Case Thermal Resistance ( θJC) ................38°C/W DC ELECTRICAL CHARACTERISTICS (VCC = +4.75V to +5.25V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5V and TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DRIVER Figure 1, RL = 100 2 VCC Differential Driver Output VOD Figure 1, RL = 54 1.5 VCC V Change in Magnitude of Differential Output Voltage VOD Figure 1, RL = 100 or 54 (Note 3) 0.2 V Driver Common-Mode Output Voltage VOC Figure 1, RL = 100 or 54 VCC / 2 3 V Change in Magnitude of Common-Mode Voltage VOC Figure 1, RL = 100 or 54 (Note 3) (MAX13442E/MAX13443E) 0.2 V DRIVER LOGIC Driver-Input High Voltage VDIH 2 V Driver-Input Low Voltage VDIL 0.8 V Driver-Input Current IDIN ±2 μA 0V VOUT +12V +350 Driver Short-Circuit Output Current (Note 4) IOSD -7V VOUT VCC -350 mA (VCC - 1V) VOUT +12V (Note 4) +25 Driver Short-Circuit Foldback Output Current IOSDF -7V VOUT +1V (Note 4) -25 mA VOUT +20V, RL = 100 +6 Driver-Limit Short-Circuit Foldback Output Current IOSDL VOUT -15V, RL = 100 -6 mA Note 1: During normal operation, a termination resistor must be connected between A and B in order to guarantee overvoltage pro- tection up to the absolute maximum rating of this device. When not in operation, these devices can withstand fault voltages up to the maximum rating without a termination resistor and will not be damaged. Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. |
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