RS-485 Transceiver with Integrated Low-Dropout

Regulator and AutoDirection Control

2

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ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

(All voltages referenced to GND.)

A, B............................................................................-8V to +13V

Short-Circuit Duration (RO, A, B) to GND ................. Continuous

8-Pin SO-EP (derate 19.2mW/°C above +70°C) ........1539mW

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range ............................-65°C to +150°C

Junction Temperature ......................................................+150°C

Lead Temperature (soldering, 10s) ................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

(Note 3)

6.0

28.0

V

4.5

5

5.5

LDO Output Voltage

4.5

5

5.5

V

LDO Output Current

20

mA

LDO Dropout Voltage

0.5

V

Guaranteed by design,

MAX13412E–MAX13415E

1µF

RE, DE = high/no load

(MAX13410E/MAX13411E)

10

Supply Current

RE, DE/RE = high, DI = low/no load

(MAX13412E–MAX13415E)

10

mA

Shutdown Current

DE = low, RE = high

(MAX13410E/MAX13411E)

45

µA

Thermal-Shutdown Threshold

+150

°C

Thermal-Shutdown Threshold

Hysteresis

15

°C

DRIVER

Ω, Figure 1

2.0

5.5

Ω, Figure 1

1.5

5.5

Differential Driver Output

No load

5.5

V

Change in Magnitude of Differential

Output Voltage

Ω or 54Ω, Figure 1

0.2

V

Driver Common-Mode Output Voltage

Ω or 54Ω, Figure 1

1

3

V

Change In Magnitude of Common-

Mode Voltage

Ω or 54Ω, Figure 1

0.2

V

Input High Voltage

DI, DE, RE, DE/RE

2.0

V

Input Low Voltage

DI, DE, RE, DE/RE

0.8

V

Input Current

DI, DE, RE, DE/RE

±1

µA

Driver-Disable Threshold

0.6

1.0

V

Note 1: Package thermal resistances were obtained using the method described in JEDEC specificactions JESD51-7 using a four layer board.

For detailed information on package consitencies refer to www.maxim-ic/thermal-tutorial.

ELECTRICAL CHARACTERISTICS