MOSA

MS6895

Mono 1.1W Fully Differential Power Amplifier

REV 1

6/7

www.mosanalog.com

APPLICATION INFORMATION

Basic application example

2

R

L

8Ω

4

3

-IN

BP

SD

+

+IN

Bias

V

DD

GND

1

6

5

8

+

-

-

+

Common

mode

7

1uF

1uF

20k

R

F1

V

DD

20k

R

F2

-

0.39uF

20k

R

I1

MCU

0.39uF

20k

+ Differential Input

R

I2

Vo2

Vo1

- Differential Input

Fig.1

A audio amplifier application circuit.

External gain-setting

resistors and feedback resistors to each other. The outputs are used to drive the mono bridged-tied load (BTL).

High Pass Filter

Thermal pad considerations

The thermal pad must be connected to ground. The package with thermal pad of the MS6895 requires special attention

on thermal design. The thermal pad on the bottom of the MS6895 should be soldered down to a copper pad on the

circuit board. Heat can be conducted away from the thermal pad through the copper plane to ambient. If the copper

plane is not on the top surface of the circuit board, 9 vias of 13 mil or smaller in diameter should be used to thermally

couple the thermal pad to the bottom plane. For good thermal conduction, the vias must be plated through and solder

filled.