поискавой системы для электроныых деталей
  Russian  ▼
ALLDATASHEETRU.COM

X  

MS6865SSGTR датащи(PDF) 17 Page - MOSA ELECTRONICS

номер детали MS6865SSGTR
подробное описание детали  Dual 2W Power Amplifier 3 Stereo Inputs with Volume Control
PDF  22 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
производитель  MOSA [MOSA ELECTRONICS]
домашняя страница  http://www.mosanalog.com
Logo MOSA - MOSA ELECTRONICS

MS6865SSGTR датащи(HTML) 17 Page - MOSA ELECTRONICS

Back Button MS6865SSGTR Datasheet HTML 13Page - MOSA ELECTRONICS MS6865SSGTR Datasheet HTML 14Page - MOSA ELECTRONICS MS6865SSGTR Datasheet HTML 15Page - MOSA ELECTRONICS MS6865SSGTR Datasheet HTML 16Page - MOSA ELECTRONICS MS6865SSGTR Datasheet HTML 17Page - MOSA ELECTRONICS MS6865SSGTR Datasheet HTML 18Page - MOSA ELECTRONICS MS6865SSGTR Datasheet HTML 19Page - MOSA ELECTRONICS MS6865SSGTR Datasheet HTML 20Page - MOSA ELECTRONICS MS6865SSGTR Datasheet HTML 21Page - MOSA ELECTRONICS Next Button
Zoom Inzoom in Zoom Outzoom out
 17 / 22 page
background image
MOSA
MS6865
3 Stereo inputs / 2W PA output with Volume Control
REV 2
17/22
www.mosanalog.com
In the SE mode, the amplifiers A2 and B2 are shutdown, and become the high output impedance states.
OUTR-
OUTL-
-1
-1
-1
-1
SCL
SDA
I2C
Interface
R
L
16Ω / 32Ω
100uF
1k
Headphone
Jack
Shutdown
Shutdown
100uF
1k
A1
A2
B1
B2
Headphone sense
The output mode is SE or BTL that is decided by a headphone. It has to be set SE mode when a headphone is plug-in
status. The output mode is selected by I2C command code by MCU. Please note that the MS6865 don’t detect a
headphone automatically. Thus a detect function is executed via MCU. An operation diagram is shown as follows:
The HP_sense pin is high when a headphone is plug-in.
The HP_sense pin is low when a headphone is not plug-in.
Thermal pad considerations
The thermal pad must be connected to ground. The package with thermal pad of the MS6865 requires the special
attention on thermal design. The thermal pad on the bottom of the MS6865 should be soldered down to a copper pad on
the circuit board. Heat can be conducted away from the thermal pad through the copper plane to ambient. If the copper
plane is not on the top surface of the circuit board, 9 vias of 13 mil or smaller in diameter should be used to thermally
couple the thermal pad to the bottom plane. For good thermal conduction, the vias must be plated through and solder
filled.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22


датащи скачать

Go To PDF Page


ссылки URL



Вашему бизинису помогли Аллдатащит?  [ DONATE ] 

Что такое Аллдатащит   |   реклама   |   контакт   |   Конфиденциальность   |   Ссылка на техническое описание    |   обмен ссыками   |   поиск по производителю
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com